Lapping / polishing is a process in which free abrasive particles are applied between the plate and an appropriately - pressed flat part, cutting the part surface without directional lines. Mirror polishing is expectable if abrasive particles with reduced granularity are used in connection with the lapping plate (a polishing pad). Lapping and polishing includes two-way, three-way and four-way polishing, corresponding to the use of single-sided or double-sided lapping / polishing machines.

JENG YUEH 's lapping /polishing machine (single) controls the flatness of its plate subject to variations. Plate conditioning is enabled during the machining process, maintaining the plate with expected flatness in long life.
 
Plate flatness control:
 
Single side work theory:
©ñ€j¹Ï

Machining samples¡G
Stainless steel mirror molds, vacuum chucks; semi-conductor wafers (e.g. : silicon wafer GaAs, LiNbO3, LiTaO3, LED, etc.), Sapphire, carbide parts, tungsten carbide parts, Cu/Al parts, ultrasonic horns, oscillator parts, ferrite cores, mechanical seals, printer plates, sewing machine parts glass parts, and quartz parts.

 
Copyright © Jeng Yueh Enterprise Co., Ltd. All Rights Reserved