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1.Standard conditioning rings
For normal lapping applications.
Depending on machine models.
   
2.Ceramics conditioning rings
For lapping or polishing applications to deliver improved surface roughness.
Depending on machine models
 
3.Auto Abrasive compound feeder system
Feed the substantially mixed abrasive via an instilment frame with flow adjustability.
   
4.Pressure weight
Metal material for applications where pneumatic pressure is unsuitable.
Depending on the machine model.
 
 
Diamond sluwy auto spray system
For automatic feeding of diamond sluwy : Atomizing, mixing, and spraying specified amount of sluwy in the specified time period.
   
  A controller and an autostirrer are included.
  Control   Stirrer
Source power 220v 1 φ Source power 220v 1 φ
pneumatic source 2-5 Kg/cm2 Mixing type 電磁誘導式
Spraying time 0-99 Sec Revolutions 0-1650 rpm
Intervals 0-99 Sec Dimensions 210 mm × 100mm × 180mmH
Dimensions 300mm × 190mm × 165mmH Weight 4.5 Kg
Weight 4 Kg    
 
 
 
Bonding machine
Bond and evenly fix a wafer on a waxed diamond plate that is sharply cooling down.
   
Bonding time 0-99min 59sec adjustable.
Upper press plate automatically rises when the specified bonding time is reached.
   
Bonding pressure 0-6 bar adjustable.
 
 
Specification
1050.5mm × 250.5mm × 725mmH
冷卻盤外徑 φ 180
適用鑽石盤 φ 139mm
 
 
Vacuum chuck
 
Load of the fixture body is adjustable.
A gauge with 0.001mm precision, made in Switzerland.
Vacuum plate flatness 0.002mm.
A suction connector to connect to a vacuum pump.
Special steel main shaft for abrasive resistance.
A vacuum pump is supplied, max. pressure 680MM/Hg (GP) .
   
 
 
     
 
 
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